Publikationen
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- Skill-based Engineering and Control on Field-Device-Level with OPC UA In Proceedings of the IEEE International Conference on Emerging Technologies And Factory Automation (ETFA), September 2019. Details BIB
- Skill-basiertes Engineering auf Basis von OPC UA Companion Specifications In 20. Leitkongress der Mess- und Automatisierungstechnik AUTOMATION 2019 – Autonomous Systems and 5G in Connected Industries, Juli 2019. Details BIB
- AutomationML Mechatronic Models as Enabler of Automation Systems Engineering: Use-case and Evaluation In Proceedings of 2018 IEEE 23rd International Conference on Emerging Technologies and Factory Automation (ETFA), Seiten 51 - 58, Oktober 2018. IEEE. Details DOI BIB
- Modeling and verifying behavioral constraints for automation systems In Industrial Informatics (INDIN), 2017 IEEE 15th International Conference on, Seiten 345–350, 2017. IEEE, Details BIB
- Towards an integrated plant engineering process using a data conversion tool for AutomationML In Dorina C. Petriu , Nicolas Rouquette und Oystein Haugen , Editor, Industrial Technology (ICIT), 2017 IEEE International Conference on, Seiten 1205–1210, 2017. IEEE, Details BIB
- A human in the loop corrective maintenance methodology using cross domain engineering data of mechatronic systems In Emerging Technologies and Factory Automation (ETFA), 2016 IEEE 21st International Conference on, Seiten 1–4, 2016. IEEE, Details BIB
- Behavior modeling of automation components using cross-domain interdependencies In Emerging Technologies and Factory Automation (ETFA), 2016 IEEE 21st International Conference on, Seiten 1–4, 2016. IEEE, Details BIB
- Engineering of Automation Systems using a Metamodel implemented in AutomationML In Xiaoping Chen , Peter Stone , LuisEnrique Sucar und Tijn van der Zant , Editor, Industrial Informatics (INDIN), 2016 IEEE 14th International Conference on, Seiten 363–370, 2016. IEEE, Details BIB
- Handling errors in dynamic production environments In Jon Whittle , Tony Clark und Thomas Kühne , Editor, Industrial Informatics (INDIN), 2016 IEEE 14th International Conference on, Seiten 148–153, 2016. IEEE, Details BIB
- Plug-and-Produce für Cyber-Physische Produktionssysteme – Eine Fallstudie im OPAK-Projekt Details BIB